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CU Plating Chemical

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  1. Sps Bis-(Sodium sulfopropyl)-disulfide

    Electroplating intermediates for Cu plating:Bis-(sodium sulfopropyl)-disulfide/SPS/SP CAS:27206-35-5 Purity:>=90%>=98%Appearance:white or yellowish powder
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  2. N N-dimethyl Dithiocarbamyl Propyl Sulfonic Acid Sodium Salt

    Name: DPS(N,N-dimethyl-dithiocarbamyl propyl sulfonic acid, sodium salt)CAS:18880-36-9 Trade name DPS Chemical name N,N-dimethyl-dithiocarbamylpropyl sulfonic acid, sodium salt Molecular formula C6H12NaO3S3 Molecular Weight 265.35 Assay 98%Appearance White to yellowish powder
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  3. 2 Mercapto Thiazoline

    Pharm chem:2-mercapto thiazoline, CAS:96-53-7 English name:2-Mercaptothiazoline Synonyms:2-Thiazolinethiol; Mercaptothiazoline; thiazolidine-2-thione; H1; 2-thio-2-thiazoline Molecular Formula:C3H5NS2 Molecular Weight:119.2 CAS Registry Number:96-53-7 EINECS:202-512-1 Melting point:105-107°C Water solubility:SOLUBLE IN HOT WATER
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  4. Tetrahydroxypropyl Ethylenediamine

    High quality Tetrahydroxypropyl ethylenediamine (EDTP) CAS No.102-60-3 Trade name: EDTP CAS No: 102-60-3 EINECS No: 203-041-4 Molecular formula: C14H32N2O4 Molecular weight: 292.41
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  5. Sodium 3 Mercaptopropanesulphonate

    Sodium 3-mercaptopropanesulphonate
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  6. Sodium 3 Mercapto1 Propanesulfonate

    MPS(Sodium 3-mercaptopropanesulphonate)/CAS No. 17636-10-1
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  7. 3 S Isothiuronium Propyl Sulfonate

    UPS(3-S-Isothiuronium propyl sulfonate)/CAS No. 21668-81-5
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  8. N Ethylenethiourea

    N (Ethylenethiourea)/CAS No. 96-45-7
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